PART |
Description |
Maker |
TMCM-351 TMCM-351-E |
3-Axis Controller/Driver 2.8A/24V Optional Encoder Interface Optional CANopen Firmware
|
TRINAMIC Motion Control GmbH & Co. KG.
|
2450AT42E0100 2450AT42E0100E |
2.4 GHz Surface Mount 2.4 GHz Surface Mount, Above Metal, Low Profile Mini Chip Antenna This antenna must have metal directly underneath on bottom layer in order to function
|
Johanson Technology Inc...
|
2450AT42E010B 2450AT42E010BE |
2.4 GHz Surface Mount 2.4 GHz Surface Mount, Above Metal, Low Profile Mini Chip Antenna This antenna must have metal directly underneath on bottom layer in order to function
|
Johanson Technology Inc...
|
TNPW |
Metal Film Layer on High Quality Ceramic, Protective Top Coat, SnPb Contacts on Ni Barrier Layer, Excellent Stability at Different Environmental Conditions
|
Vishay
|
PDI1394L41BE PDI1394L41 |
Content Protection AV Link Layer(???????ょ?AV?炬?灞???跺?) Content Protection AV Link Layer(内容可保护的AV链接层控制器) 影音内容保护链路层(内容可保护的视听链接层控制器 1394 content protection AV link layer controller
|
NXP Semiconductors N.V.
|
CE201210-6N8J CE201210-5N6J CE201210-4N7J CE201210 |
IC,MOT,MC68HC908GR8CP, DIP-28, MCU FLASH 8BIT 8MHZ 4K IC,MCU,MC68HC908JB8ADW,8-BIT SOIC-28,21 I/O,3MHZ IC,MCU,MC68HC711E9CFN2,8-BIT 2MHz,PLCC52 8-BIT, OTPROM, 2.1 MHz, MICROCONTROLLER, PDIP20 IC,MCU,MC68HC908KX8CDW,8-BIT SOIC-16,13 I/O,8MHZ Multi-Layer Chip Inductors 1 ELEMENT, 0.12 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD Multi-Layer Chip Inductors 1 ELEMENT, 0.0056 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD Multi-Layer Chip Inductors 1 ELEMENT, 0.33 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD Multi-Layer Chip Inductors 1 ELEMENT, 0.0027 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD Multi-Layer Chip Inductors 1 ELEMENT, 0.0068 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD Multi-Layer Chip Inductors 1 ELEMENT, 0.0082 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD IC,MCU,MC68HC705C9ACFN,8-BIT PLCC-44,31 I/O,2MHZ 多层片式电感 Multi-Layer Chip Inductors 1 ELEMENT, 0.39 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
|
Bourns Inc. Bourns, Inc.
|
22-17-2172 A-4455-BH17D 0022172172 |
2.54mm (.100) Pitch KK? PC Board Connector, Bottom Entry, 0.50μm (20μ) Gold (Au), 17 Circuits 2.54mm (.100) Pitch KK庐 PC Board Connector, Bottom Entry, 0.50渭m (20渭) Gold (Au), 17 Circuits 2.54mm (.100) Pitch KK垄莽 PC Board Connector, Bottom Entry, 0.50楼矛m (20楼矛) Gold (Au), 17 Circuits
|
Molex Electronics Ltd.
|
22-14-2234 0022142234 A-4455-BH23D |
2.54mm (.100) Pitch KK? PC Board Connector, Bottom Entry, 2.54μm (100μ) Tin (Sn), 23 Circuits 2.54mm (.100) Pitch KK庐 PC Board Connector, Bottom Entry, 2.54渭m (100渭) Tin (Sn), 23 Circuits 2.54mm (.100) Pitch KK垄莽 PC Board Connector, Bottom Entry, 2.54楼矛m (100楼矛) Tin (Sn), 23 Circuits
|
Molex Electronics Ltd.
|
MAS3519F MAS3529F MAS3539F MAS3549F MAS3559F MAS35 |
MAS 35x9F MPEG Layer 2/3, AAC Audio Decoder, G.729 Annex A Codec 新加坡金融管理局35x9F的MPEG 2 / 3层,AAC音频解码器,G.729的附A编解码器 (MAS35x9F) MPEG Layer 2/3 AAC Audio Decoder MAS 35x9F MPEG Layer 2/3, AAC Audio Decoder, G.729 Annex A Codec 新加坡金融管理局35x9F的MPEG 2 / 3层,AAC音频解码器,G.729的附件A编解码器
|
Micronas Semiconductor Holding AG
|
006200505130000 00-6200-512-130-000 00-6200-512-23 |
1.0mmPitch RA Through hole / SMT Bottom contact Slide lock 1.0mm Pitch RA Through hole / SMT Bottom contact Slide lock
|
AVX Corporation
|
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